IP Library Assignment 026893/0739
Patent Assignment
Reel/Frame 026893/0739

Change of Name

Recorded: 2011-09-13 Pages: 10
Assignor
FOXCONN ADVANCED TECHNOLOGY INC.
Executed: 2011-06-13
Assignee
ZHEN DING TECHNOLOGY CO., LTD.
NO. 6, LANE 28, SAN HO RD., SAN SHI VILLAGE, TAYUAN, TAOYUAN, TAIWAN
Covered Property (1)
Method for Forming Stacked via-Holes in a Multilayer Printed Circuit Board
Patent: 7,418,780 →
Application: 11/560,787 →
Publication: US 2007/0266559
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 16, 2006
From: LEE, WEN-CHIN; LIN, CHENG-HSIEN
To: FOXCONN ADVANCED TECHNOLOGY INC.
Reel/Frame 018529/0668 →
Assignment of Assignor's Interest Jan 17, 2017
From: ZHEN DING TECHNOLOGY CO., LTD.
To: GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0807 →