Assignment of Assignor's Interest

Recorded: 2006-11-17 Pages: 2

Assignor

FUJITA, TAKASHI

Executed: 2006-11-15

Assignee

TOKYO SEIMITSU CO., LTD.

7-1, SHIMORENJAKU 9-CHOME, MITAKA-SHI, TOKYO, JAPAN

Covered Property (1)

Wafer Polishing Apparatus and Wafer Polishing Method

Patent: 7,753,761 →

Application: 11/560,952 →

Publication: US 2007/0161338

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.