Patent Assignment
Reel/Frame 026973/0294
Change of Address
Recorded: 2011-09-22
Pages: 3
Assignor
TOKYO SEIMITSU CO., LTD.
Executed: 2011-06-09
Assignee
TOKYO SEIMITSU CO., LTD.
2968-2, ISHIKAWA-MACHI, HACHIOJI-SHI, TOKYO, JAPAN
Covered Property
(1)
Wafer Polishing Apparatus and Wafer Polishing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.