Patent Assignment
Reel/Frame 018532/0686
Assignment of Assignor's Interest
Recorded: 2006-11-02
Pages: 3
Assignee
S-BOND TECHNOLOGIES, LLC
811 W. FIFTH STREET, UNIT 2, LANSDALE, PENNSYLVANIA, 19460
Covered Property
(1)
Electronic Package Formed Using Low-Temperature Active Solder Including Indium, Bismuth, and/or Cadmium