IP Library › Assignment 018559/0835
Patent Assignment
Reel/Frame 018559/0835

Assignment of Assignor's Interest

Recorded: 2006-11-29 Pages: 4
Assignors
YANG, CHIH-CHAO
Executed: 2006-11-21
YANG, HAINING
Executed: 2006-11-22
WONG, KEITH KWONG HON
Executed: 2006-11-21
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Dual Liner Capping Layer Interconnect Structure and Method
Patent: 7,576,003 →
Application: 11/564,314 →
Publication: US 2008/0122045
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 26, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 054528/0023 →