Patent Assignment
Reel/Frame 018563/0271
Assignment of Assignor's Interest
Recorded: 2006-11-22
Received: 2006-11-22
Pages: 3
Assignor
HITACHI, LTD.
Executed: 2006-06-14
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JPX, JAPAN
Covered Properties
(20)
Semiconductor Integrated Circuit
Application:
11/349,918 →
Semiconductor Memory Device Using Open Data Line Arrangement
Application:
10/676,110 →
Semiconductor Integrated Circuit
Application:
10/637,694 →
Semiconductor integrated circuit with memory redundancy circuit
Application:
10/600,541 →
Data Transmission Device, Data Transfer System and Method
Application:
10/333,132 →
Semiconductor Device
Application:
10/354,122 →
Memory-Module with an Increased Density for Mounting Semiconductor Chips
Application:
10/326,149 →
Jaw Pad for a Protective Helmet
Application:
29/169,155 →
Method of Manufacturing Semiconductor Devices Utilizing Underlayer-Dependency of Deposition of Capacitor Electrode Film, and Semiconductor Device
Application:
10/211,569 →
Inflatable Crown Liner for a Protective Helmet
Application:
29/164,154 →
Directional Coupling Memory Module
Application:
10/191,112 →
Semiconductor Integrated Circuit
Application:
10/155,085 →
Semiconductor Device
Application:
10/139,330 →
Football Helmet
Application:
29/155,532 →
Data Transmitter
Application:
09/988,152 →
Semiconductor Integrated Circuit
Application:
09/923,542 →
Semiconductor Device Having a Capacitor Structure Including a Self-Alignment Deposition Preventing Film
Application:
09/810,401 →
Method of Manufacturing Semiconductor Devices Utilizing Underlayer-Dependency of Deposition of Capacitor Electrode Film, and Semiconductor Device
Application:
09/810,627 →
Modular Drop Mechanism for Chiropractic Table
Application:
09/795,164 →
Method of Manufacturing Semiconductor Devices Utilizing Underlayer-Dependency of Deposition of Capacitor Electrode Film, and Semiconductor Device
Application:
09/767,706 →