Patent Assignment
Reel/Frame 018578/0171
Assignment of Assignor's Interest
Recorded: 2006-11-14
Pages: 2
Assignors
LEE, BYOUNG HWA
Executed: 2006-10-16
CHUNG, HAE SUK
Executed: 2006-10-16
PARK, DONG SEOK
Executed: 2006-10-16
PARK, MIN CHEOL
Executed: 2006-10-16
PARK, SANG SOO
Executed: 2006-10-16
WI, SUNG KWON
Executed: 2006-10-16
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Chip Capacitor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.