IP Library › Assignment 018593/0102
Patent Assignment
Reel/Frame 018593/0102

Assignment of Assignor's Interest

Recorded: 2006-12-06 Pages: 4
Assignor
EKLIND, EVERT
Executed: 2006-08-25
Assignee
NESTEC S.A.
AVENUE NESTLE 55, CH-1800 VEVEY, SWITZERLAND
Covered Property (1)
Multilayer Chip Capacitor
Patent: 7,599,166 →
Application: 11/598,672 →
Publication: US 2007/0109717
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 14, 2006
From: LEE, BYOUNG HWA; CHUNG, HAE SUK; PARK, DONG SEOK; PARK, MIN CHEOL
To: SAMSUNG ELECTRO-MECHANICS CO., LTD
Reel/Frame 018578/0171 →