IP Library › Assignment 018624/0517
Patent Assignment
Reel/Frame 018624/0517

Assignment of Assignor's Interest

Recorded: 2006-12-13 Pages: 4
Assignors
MACNAMARA, CORMAC
Executed: 2006-07-25
BROGAN, CONOR
Executed: 2006-07-25
GRIFFIN, HUGH J.
Executed: 2006-07-25
WILSON, ROBIN
Executed: 2006-11-09
Assignee
ICEMOS TECHNOLOGY CORPORATION
P.O. BOX 24619, TEMPE, ARIZONA, 85285
Covered Property (1)
Silicon Wafer Having Through-Wafer Vias
Patent: 7,553,764 →
Application: 11/381,605 →
Publication: US 2006/0275946
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 8, 2009
From: ICEMOS TECHNOLOGY CORPORATION
To: ICEMOS TECHNOLOGY LTD.
Reel/Frame 022076/0237 →