Assignment of Assignor's Interest

Recorded: 2006-12-15 Received: 2006-12-15 Pages: 32

Assignor

U.S. PHILIPS CORPORATION

Executed: 2006-11-27

Assignee

NXP B.V.

HIGH TECH CAMPUS 60, 5656 AG EINDHOVEN, NLX, NETHERLANDS

Covered Properties (18)

Transmitter Power Amplifier Ramping Method

Application: 11/536,312 →

Method of Eliminating a Dc Component and Filtering Device Obtained by This Method

Application: 10/359,504 →

Semiconductor Wafer with Process Control Modules

Application: 10/081,893 →

Automatic Gain Control

Application: 09/958,130 →

Electronic Component with Reduced Inductive Coupling

Application: 09/913,442 →

Semiconductor Device with a Bipolar Transistor, and Method of Manufacturing Such a Device

Application: 09/854,403 →

Method of Manufacturing Semiconductor Device with a Tunnel Diode

Application: 09/832,724 →

Recognition of Wide-Band Data Sequences

Application: 09/817,977 →

Method and Quadrature Device for Compensating Mismatch in Parallel Paths by Switching Signals Therein

Application: 09/805,481 →

Method of Forming an Etch Stop Layer in a Semiconductor Device

Application: 09/804,004 →

Method of, and Receiver for, Detecting the Presence of Data

Application: 09/801,600 →

Method of Producing a Schottky Varicap

Application: 09/797,086 →

Data Carrier Having Means for Synchronization with a Received Data Stream

Application: 09/794,981 →

Current Mirror Arrangement

Application: 09/763,840 →

Method of Manufacturing a Hybrid Integrated Circuit Comprising a Semiconductor Element and a Piezoelectric Filter

Application: 09/790,346 →

Electronic part

Application: 09/762,655 →

Communications Network Having a Time-Controlled Communication Protocol

Application: 09/781,504 →

Data-Processing Device and Method of Operating Said Device

Application: 09/754,635 →