Patent Assignment
Reel/Frame 018654/0538
Merger
Recorded: 2006-12-20
Pages: 5
Assignor
SIGNETICS COMPANY
Executed: 1992-06-29
Assignee
NORTH AMERICAN PHILIPS CORPORATION
1251 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10020
Covered Properties
(4)
Protection Device Utilizing One or More Subsurface Diodes and Associated Method of Manufacture
Patent:
4,736,271 →
Application:
07/065,450 →
System for High Speed Digital Transmission in Repetitive Noise Environment
Patent:
4,845,466 →
Application:
07/086,443 →
Method for Manufacturing a Planar Electrical Interconnection Utilizing Isotropic Deposition of Conductive Material
Patent:
5,063,175 →
Application:
07/287,582 →
Field-Programmable Logic Device with Programmable Foldback to Control Number of Logic Levels
Patent:
5,075,576 →
Application:
07/642,655 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0514 →
Change of Name
Dec 20, 2006
From: NORTH AMERICAN PHILIPS CORPORATION
To: PHILIPS ELECTRONICS NORTH AMERICAN CORPORATION
Reel/Frame 018654/0565 →
Change of Name
Dec 20, 2006
From: SIGNETICS CORPORATION
To: SIGNETICS COMPANY
Reel/Frame 018654/0570 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →