Patent Assignment
Reel/Frame 018654/0565
Change of Name
Recorded: 2006-12-20
Pages: 5
Assignor
NORTH AMERICAN PHILIPS CORPORATION
Executed: 1993-05-24
Assignee
PHILIPS ELECTRONICS NORTH AMERICAN CORPORATION
1251 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10020
Covered Properties
(38)
Protection Device Utilizing One or More Subsurface Diodes and Associated Method of Manufacture
Patent:
4,736,271 →
Application:
07/065,450 →
System for High Speed Digital Transmission in Repetitive Noise Environment
Patent:
4,845,466 →
Application:
07/086,443 →
Method of Fabricating Field-Effect Transistor Utilizing Improved Gate Sidewall Spacers
Patent:
4,786,609 →
Application:
07/104,187 →
Complementary Voltage Interpolation Circuit with Transmission Delay Compensation
Patent:
4,897,656 →
Application:
07/127,867 →
Reactive Ion Etching of Silicon with Hydrogen Bromide
Patent:
5,007,982 →
Application:
07/217,536 →
Method for Manufacturing a Planar Electrical Interconnection Utilizing Isotropic Deposition of Conductive Material
Patent:
5,063,175 →
Application:
07/287,582 →
Method of Synchronizing Parallel Processors Employing Channels and Compiling Method Minimizing Cross-Processor Data Dependencies
Patent:
5,317,734 →
Application:
07/400,178 →
Transistor Manufacturing Process Using Three-Step Base Doping
Patent:
5,006,476 →
Application:
07/440,456 →
Method and Apparatus for Providing Synchronized Data Cache Operation for Processors in a Parallel Processing System
Patent:
5,261,067 →
Application:
07/510,336 →
Dynamically Configurable Signal Processor and Processor Arrangement
Patent:
5,034,907 →
Application:
07/614,043 →
Formation of Composite Monosilicon/Polysilicon Layer Using Reduced- Temperature Two-Step Silicon Deposition
Patent:
5,110,757 →
Application:
07/630,140 →
Field-Programmable Logic Device with Programmable Foldback to Control Number of Logic Levels
Patent:
5,075,576 →
Application:
07/642,655 →
Power Integrated Circuit Having Reverse-Voltage Protection
Patent:
5,151,767 →
Application:
07/695,490 →
Compandor System with Stable and Widely Adjustable Unity Gain Level
Patent:
5,179,361 →
Application:
07/700,279 →
Protected Programmable Transistor with Reduced Parasitic Capacitances and Method of Fabrication
Patent:
5,424,567 →
Application:
07/700,663 →
System for Partitioning and Testing Submodule Circuits of an Integrated Circuit
Patent:
5,107,208 →
Application:
07/715,035 →
Method for Making an Improved High Voltage Thin Film Transistor Having a Linear Doping Profile
Patent:
5,246,870 →
Application:
07/811,554 →
Vertical Power Mos Device with Increased Ruggedness and Method of Fabrication
Patent:
5,268,586 →
Application:
07/842,853 →
Differential Input Buffer-Inverters and Gates
Patent:
5,250,856 →
Application:
07/863,551 →
Semiconductor Device Configuration with Multiple Hv-Ldmos Transistors and a Floating Well Circuit
Patent:
5,446,300 →
Application:
07/971,382 →
High Voltage Thin Film Transistor Having a Linear Doping Profile and Method for Making
Patent:
5,300,448 →
Application:
08/015,061 →
Instruction Cache System for Implementing Programs Having Non- Sequential Instructions and Method of Implementing Same
Patent:
5,701,435 →
Application:
08/063,845 →
Analog Autonomous Test Bus Framework for Testing Integrated Circuits on a Printed Circuit Board
Patent:
5,581,176 →
Application:
08/066,957 →
Vertical Power Mos Device with Increased Ruggedness and Method of Fabrication
Patent:
5,374,571 →
Application:
08/072,802 →
Method for Making an Improved High Voltage Thin Film Transistor Having a Linear Doping Profile
Patent:
5,412,241 →
Application:
08/101,164 →
Bi-Directional Signal Transmission System and Adapter for Such a System
Patent:
5,790,526 →
Application:
08/327,123 →
Method of Fabrication of Protected Programmable Transistor with Reduced Parasitic Capacitances
Patent:
5,486,480 →
Application:
08/330,645 →
Analog Autonomous Test Bus Framework for Testing Integrated Circuits on a Printed Circuit Board
Patent:
5,717,329 →
Application:
08/407,535 →
Analog Autonomous Test Bus Framework for Testing Integrated Circuits on a Printed Circuit Board
Patent:
5,705,925 →
Application:
08/447,369 →
High Voltage Thin Film Transistor Having a Linear Doping Profile
Patent:
5,767,547 →
Application:
08/448,268 →
Analog Autonomous Test Bus Framework for Testing Integrated Circuits on a Printed Circuit Board
Patent:
5,731,701 →
Application:
08/695,469 →
Write Control Unit
Patent:
5,862,399 →
Application:
08/715,060 →
System for Partitioning and Testing Submodule Circuits of an Integrated Circuit
Patent:
37,500 →
Application:
08/752,827 →
Vliw Processor with Less Instruction Issue Slots Than Functional Units
Patent:
6,002,880 →
Application:
08/810,003 →
Synchronizing Parallel Processors Using Barriers Extending Over Specific Multiple-Instruction Regions in Each Instruction Stream
Patent:
5,802,374 →
Application:
08/839,731 →
Analog Autonomous Test Bus Framework for Testing Integrated Circuits on a Printed Circuit Board
Patent:
6,011,387 →
Application:
08/994,876 →
Vliw Processor with Write Control Unit for Allowing Less Write Buses Than Functional Units
Patent:
6,044,451 →
Application:
09/090,038 →
Vliw Processor with Less Instruction Issue Slots Thatn Functional Units
Patent:
6,122,722 →
Application:
09/271,202 →
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Oct 5, 1987
From: CHEN, TEH-YI J.
To: SIGNETICS CORPORATION, 811 EAST ARQUES AVENUE, SUNNYVALE, CA. 94088-3409, A CA. CORP.
Reel/Frame 004811/0738 →
Assignment of Assignors Interest.
Apr 18, 1988
From: VAN DE PLASSCHE, RUDY J.; BALTUS, PETER G.
To: NORTH AMERICAN PHILIPS CORPORATION, A DE CORP.
Reel/Frame 004860/0539 →
Assignment of Assignors Interest.
Aug 29, 1989
From: GUPTA, RAJIV
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 005119/0027 →
Assignment of Assignors Interest.
Apr 17, 1990
From: WHELAN, MICHAEL P.
To: NORTH AMERICAN PHILIPS CORPORATION, A CORP. OF DELAWARE
Reel/Frame 005283/0022 →
Assignment of Assignors Interest.
Mar 11, 1991
From: ARST, MARGARETH C.; CHEN, TEH-YI J.; RITZ, KENNETH N.; REDKAR, SHAILESH S.
To: SIGNETICS COMPANY
Reel/Frame 005651/0260 →
Assignment of Assignors Interest.
Apr 8, 1991
From: SIGNETICS COMPANY
To: NORTH AMERICAN PHILIPS CORPORATION, A CORP. OF DE
Reel/Frame 005659/0605 →
Assignment of Assignors Interest.
May 3, 1991
From: WONG, STEPHEN L.
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 005701/0528 →
Assignment of Assignors Interest.
May 15, 1991
From: NAVID, NASROLLAH S.; DELURIO, MICHAEL J.
To: NORTH AMERICAN PHILIPS CORPORATION A CORP. OF DE
Reel/Frame 005714/0523 →
Assignment of Assignors Interest.
May 15, 1991
From: CHEN, TEH-YI J.
To: NORTH AMERICAN PHILIPS CORPORATION A CORP. OF DELAWARE
Reel/Frame 005708/0197 →
Assignment of Assignors Interest.
Dec 20, 1991
From: MERCHANT, STEVEN L.
To: NORTH AMERICAN PHILIPS CORPORATION A DE CORPORATION
Reel/Frame 005979/0248 →
Assignment of Assignors Interest.
Apr 9, 1992
From: MUKHERJEE, SATYENDRANATH; KIM, MANJIN J.
To: NORTH AMERICAN PHILIPS CORPORATION A CORP. OF DELAWARE
Reel/Frame 006073/0395 →
Assignment of Assignor's Interest
Apr 12, 1993
From: AMATO, MICHAEL; MUKHERJEE, SATYENDRANATH; VELDMAN, PAUL R.; WEGENER, ARMIN F.
To: NORTH AMERICAN PHILIPS CORP.
Reel/Frame 006551/0372 →
Assignment of Assignor's Interest
May 24, 1993
From: LEE, NAI-CHI
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 006558/0896 →
Assignment of Assignor's Interest
Aug 25, 1997
From: PHILIPS ELECTRONICS NORTH AMERICA CORPORATION
To: U.S. PHILIPS CORPORATION
Reel/Frame 008698/0171 →
Change of Name
Dec 20, 2006
From: SIGNETICS CORPORATION
To: SIGNETICS COMPANY
Reel/Frame 018654/0570 →
Assignment of Assignor's Interest
Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0514 →
Merger
Dec 20, 2006
From: SIGNETICS COMPANY
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 018654/0538 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest
Sep 2, 2010
From: U.S. PHILIPS CORPORATION
To: NXP B.V.
Reel/Frame 024927/0151 →
Assignment of Assignor's Interest
Sep 21, 2010
From: CHI, CHI-HUNG
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 025017/0535 →
Nunc Pro Tunc Assignment
Nov 22, 2010
From: U.S. PHILIPS CORPORATION
To: NXP B.V.
Reel/Frame 025392/0945 →
Release of Security Interest
Apr 20, 2011
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 026153/0847 →
Assignment of Assignor's Interest
Apr 21, 2011
From: SINO MATRIX TECHNOLOGY INC.
To: LIYUE CAPITAL, LLC
Reel/Frame 026160/0125 →
Assignment of Assignor's Interest
Apr 21, 2011
From: NXP B.V.
To: SINO MATRIX TECHNOLOGY INC.
Reel/Frame 026160/0111 →
Correction to the Recordation Cover Sheet of the Security Agreement Recorded at 018806/0201 on 1/22/2007
May 20, 2011
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 026319/0879 →