Patent Assignment
Reel/Frame 018654/0570
Change of Name
Recorded: 2006-12-20
Pages: 5
Assignor
SIGNETICS CORPORATION
Executed: 1990-12-26
Assignee
SIGNETICS COMPANY
1251 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10020
Covered Properties
(4)
Protection Device Utilizing One or More Subsurface Diodes and Associated Method of Manufacture
Patent:
4,736,271 →
Application:
07/065,450 →
System for High Speed Digital Transmission in Repetitive Noise Environment
Patent:
4,845,466 →
Application:
07/086,443 →
Method for Manufacturing a Planar Electrical Interconnection Utilizing Isotropic Deposition of Conductive Material
Patent:
5,063,175 →
Application:
07/287,582 →
Field-Programmable Logic Device with Programmable Foldback to Control Number of Logic Levels
Patent:
5,075,576 →
Application:
07/642,655 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2006
From: PHILIPS ELECTRONICS NORTH AMERICA CORP.
To: NXP B.V.
Reel/Frame 018654/0514 →
Merger
Dec 20, 2006
From: SIGNETICS COMPANY
To: NORTH AMERICAN PHILIPS CORPORATION
Reel/Frame 018654/0538 →
Change of Name
Dec 20, 2006
From: NORTH AMERICAN PHILIPS CORPORATION
To: PHILIPS ELECTRONICS NORTH AMERICAN CORPORATION
Reel/Frame 018654/0565 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →