Patent Assignment
Reel/Frame 018730/0964
Corrective Assignment to Correct the Assignee Name Previously Recorded on Reel 017866 Frame 0007. Assignor(S) Hereby Confirms the Assignment.
Recorded: 2007-01-09
Pages: 5
Assignors
SHIN, HYEON JIN
Executed: 2006-04-09
JEONG, HYUN DAM
Executed: 2006-04-09
HYUN, SANG HEON
Executed: 2006-04-09
SEON, JONG BAEK
Executed: 2006-04-09
CHUNG, YOUNG SU
Executed: 2006-04-09
Assignee
SAMSUNG CORNING CO., LTD
472, SIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-732, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Thin Film Using Self-Assembled Monolayers and Methods of Production Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: SHIN, HYEON JIN; CHUNG YOUNG SU; JEONG, HYUN DAM; HYUN, SANG HEON
To: SAMSUNG CORNING CO. LTD.
Reel/Frame 017866/0007 →
Merger
Mar 10, 2008
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 020624/0240 →
Corrective Assignment to Correct the Assignee/Assignor Previously Recorded on Reel 020624 Frame 0240. Assignor(S) Hereby Confirms the Merger.
May 16, 2008
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 020956/0832 →
Change of Name
Aug 6, 2010
From: SAMSUNG CORNING PRECISION GLASS CO., LTD.
To: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 024804/0238 →
Change of Name
Jan 16, 2015
From: SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
To: CORNING PRECISION MATERIALS CO., LTD.
Reel/Frame 034774/0676 →