Patent Assignment
Reel/Frame 018734/0429
Assignment of Assignor's Interest
Recorded: 2007-01-09
Pages: 3
Assignors
CHA, YONG-WON
Executed: 2007-01-05
SUH, DONG-CHUL
Executed: 2007-01-05
BAE, DAE-LOK
Executed: 2007-01-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Manufacturing a Three-Dimensional Semiconductor Device and Semiconductor Devices Fabricated Thereby