IP Library › Assignment 018741/0825
Patent Assignment
Reel/Frame 018741/0825

Assignment of Assignor's Interest

Recorded: 2007-01-08 Pages: 4
Assignors
MAEDA, SUSUMU
Executed: 2006-09-14
SUGIMAN, TAKAHISA
Executed: 2006-09-15
SADOHARA, SHINYA
Executed: 2006-09-15
YOSHINO, SHIRO
Executed: 2006-09-15
NAKAMURA, KOUZO
Executed: 2006-09-15
Assignee
KOMATSU ELECTRONIC METALS CO., LTD.
25-1, SHINOMIYA 3-CHOME, HIRATSUKA-SHI, KANAGAWA 254-0014, JAPAN
Covered Property (1)
Silicon Semiconductor Substrate Heat-Treatment Method and Silicon Semiconductor Substrate Treated by the Method
Patent: 7,759,227 →
Application: 11/578,814 →
Publication: US 2007/0252239
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 1, 2010
From: KOMATSU ELECTRONIC METALS CO., LTD.
To: SUMCO TECHXIV CORPORATION
Reel/Frame 024461/0984 →