Patent Assignment
Reel/Frame 024461/0984
Change of Name
Recorded: 2010-06-01
Pages: 12
Assignor
KOMATSU ELECTRONIC METALS CO., LTD.
Executed: 2007-01-01
Assignee
SUMCO TECHXIV CORPORATION
25-1, SHINOMIYA 3- CHOME, HIRATSUKA-SHI, KANAGAWA, 254-0014, JAPAN
Covered Property
(1)
Silicon Semiconductor Substrate Heat-Treatment Method and Silicon Semiconductor Substrate Treated by the Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.