Patent Assignment
Reel/Frame 018760/0595
Assignment of Assignor's Interest
Recorded: 2006-12-29
Pages: 3
Assignors
YANG, WEN-KUN
Executed: 2006-12-28
CHANG, JUI-HSIEN
Executed: 2006-12-28
WANG, TUNG-CHUAN
Executed: 2006-12-28
Assignee
ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
NO. 65, GUANGFU N. RD., HUKOU TOWNSHIP, HSINCHU COUNTY, ROC 303, TAIWAN
Covered Property
(1)
Semiconductor Image Device Package with Die Receiving Through-Hole and Method of the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Sep 15, 2023
From: ADL ENGINEERING INC.; ADVANCED CHIP ENGINEERING TECHNOLOGY INC.
To: ADL ENGINEERING INC.
Reel/Frame 064926/0845 →
Change of Name
Sep 15, 2023
From: ADL ENGINEERING INC.
To: ADL ENERGY CORP.
Reel/Frame 064927/0462 →
Assignment of Assignor's Interest
Dec 27, 2023
From: ADL ENERGY CORP.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065957/0661 →