Patent Assignment
Reel/Frame 018791/0508
Assignment of Assignor's Interest
Recorded: 2007-01-23
Pages: 3
Assignors
FUKASAWA, MASATO
Executed: 2006-10-11
KOYAMA, NAOYUKI
Executed: 2006-10-11
KURATA, YASUSHI
Executed: 2006-10-11
HAGA, KOUJI
Executed: 2006-10-11
AKUTSU, TOSHIAKI
Executed: 2006-10-11
OOTSUKI, YUUTO
Executed: 2006-10-11
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, 163-0449, JAPAN
Covered Property
(1)
Cmp Polishing Slurry and Method of Polishing Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Mar 3, 2016
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 037987/0215 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →