IP Library Assignment 018880/0539
Patent Assignment
Reel/Frame 018880/0539

Assignment of Assignor's Interest

Recorded: 2007-02-08 Pages: 3
Assignors
HUMPSTON, GILES
Executed: 2007-01-26
THOMPSON, JESSE BURL
Executed: 2006-12-12
Assignee
TESSERA, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
Microelectronic Component with Foam-Metal Posts
Patent: 7,510,401 →
Application: 11/546,899 →
Publication: US 2008/0090427
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073657/0979 →
Change of Name Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0661 →