Microelectronic component with foam-metal posts
View Patent ↗A microelectronic component having a base and a plurality of conductive posts extending from said base. Each of the posts is formed from a connected lattice of metal having voids therein. The lattice may be formed by depositing metal onto a sacrificial element such as an open-celled polymeric foam. During use or during processing, the posts may be deformed , as by crushing the lattice.
1. A microelectronic package, comprising:
a microelectronic component, comprising:
a. a base having a flexible panel having first and second oppositely-directed faces; and
b. a plurality of conductive posts extending from said base, each of said plurality of conductive posts having a volume thereof and being formed from a connected lattice of metal having voids therein, said posts projecting from said first face of said panel; and
a microelectronic element having faces and contacts spaced from and overlying said second face of said panel such that said plurality of conductive posts extend away from said microelectronic element, at least some of said conductive posts being electrically interconnected with said microelectronic element, each of the posts further having respective bases thereof, said bases being moveable with respect to said microelectronic element.
2. The microelectronic package of claim 1 further including a plurality of support elements disposed between said microelectronic element and said panel, at least some of said conductive posts being offset from said support elements.
3. The package of claim 1 , wherein at least some of said support elements are electrically conductive, said conductive support elements electrically interconnecting at least some of the contacts of said microelectronic element with at least some of said conductive posts.
4. The package of claim 1 , further comprising a plurality of traces in conductive communication with said posts and said microelectronic element.
5. The package of claim 1 , further comprising an exposed finish metal overlying said connected lattice of metal.
6. The package of claim 3 , wherein at least some of said posts are connected to at least some of said contacts by conductive support elements immediately adjacent to such posts.
7. The package of claim 6 further including conductive traces provided on said flexible panel, wherein said conductive traces electrically interconnect at least some of said conductive posts with at least some of said conductive support elements.
8. The package of claim 1 , further comprising a compliant layer disposed between the flexible panel and said microelectronic element.
9. The package of claim 4 , wherein said plurality of traces overlie and extend from said bases of posts.