IP Library › Assignment 018920/0974
Patent Assignment
Reel/Frame 018920/0974

Assignment of Assignor's Interest

Recorded: 2007-02-22 Pages: 3
Assignors
LUAN, JIAN
Executed: 2007-01-26
HAO, JIE
Executed: 2007-01-26
Assignee
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Device Having Recessed Landing Pad and Its Method of Fabrication
Patent: 7,476,924 →
Application: 11/550,553 →
Publication: US 2007/0152257
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 16, 2007
From: PARK, JE-MIN; OH, HO-JIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 019026/0082 →