IP Library › Assignment 019026/0082
Patent Assignment
Reel/Frame 019026/0082

Assignment of Assignor's Interest

Recorded: 2007-03-16 Pages: 4
Assignors
PARK, JE-MIN
Executed: 2007-03-08
OH, HO-JIN
Executed: 2007-03-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Device Having Recessed Landing Pad and Its Method of Fabrication
Patent: 7,476,924 →
Application: 11/550,553 →
Publication: US 2007/0152257
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 22, 2007
From: LUAN, JIAN; HAO, JIE
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 018920/0974 →