IP Library Assignment 018921/0257
Patent Assignment
Reel/Frame 018921/0257

Assignment of Assignor's Interest

Recorded: 2007-02-22 Pages: 2
Assignors
ONO, HIROSHI
Executed: 2006-12-10
ASHIZAWA, TORANOSUKE
Executed: 2006-12-10
KAMIGATA, YASUO
Executed: 2006-12-10
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property (1)
Polishing Slurry for Polishing Aluminum Film and Polishing Method for Polishing Aluminum Film Using the Same
Patent: 7,887,609 →
Application: 11/602,503 →
Publication: US 2007/0141957
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →