Patent Assignment
Reel/Frame 018922/0383
Assignment of Assignor's Interest
Recorded: 2007-02-22
Pages: 2
Assignor
MA, BYUNG JIN
Executed: 2007-01-23
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314, MAETAN3-DONG, YEONGTONG-GU,, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing High Power Array Type Semiconductor Laser Device
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.