Patent Assignment
Reel/Frame 018999/0371
Assignment of Assignor's Interest
Recorded: 2007-03-12
Pages: 2
Assignors
ABBO, ANTENEH A.
Executed: 2007-01-17
SEVAT, LEO
Executed: 2007-01-17
KLEIHORST, RICHARD P.
Executed: 2007-01-17
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, EINDHOVEN, 5621 BA, NETHERLANDS
Covered Property
(1)
Interconnections in Simd Processor Architectures
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest
Aug 8, 2011
From: NXP SEMICONDUCTORS N.V., ON BEHALF OF ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: INVENSAS CORPORATION
Reel/Frame 026725/0852 →
Corrective Assignment to Correct Name of Conveying Parties Previously Recorded on Reel 026725, Frame 0852.
Jun 14, 2012
From: NXP SEMICONDUCTORS N.V., ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: INVENSAS CORPORATION
Reel/Frame 028407/0179 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →