IP Library › Assignment 026725/0852
Patent Assignment
Reel/Frame 026725/0852

Assignment of Assignor's Interest

Recorded: 2011-08-08 Received: 2011-08-08 Pages: 14
Assignor
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties (16)
Wirebonding Method and Apparatus
Application: 12/506,065 →
Integrated Circuit Package Device with Improved Bond Pad Connections, a Lead-Frame and an Electronic Device
Application: 11/817,019 →
Interconnections in Simd Processor Architectures
Application: 11/575,068 →
Method and System for Powering an Integrated Circuit
Application: 10/576,570 →
Intergrated Circuit with Dynamic Communication Service Selection
Application: 10/566,552 →
Hierarchical Memory Access via Pipelining with Deferred Arbitration
Application: 11/165,859 →
Coarse Delay Tuner Circuits with Edge Suppressors in Delay Locked Loops
Application: 10/538,378 →
Wirebonding Method and Apparatus
Application: 10/538,281 →
Data Carrier with a Module with a Reinforcement Strip
Application: 10/534,165 →
Version-Programmable Circuit Module
Application: 10/525,804 →
Fluid Sampling System and Method Thereof
Application: 10/818,771 →
Lead-Frame Configuration for Chips
Application: 10/478,269 →
Processor Bus Arrangement
Application: 10/381,216 →
Folded-Flex Bondwire-Less Multichip Power Package
Application: 10/294,011 →
High Performance Chip/Package Inductor Integration
Application: 09/947,430 →
Integrated Circuit with Flash Memory Including Dedicated Flash Bus and Flash Bridge
Application: 09/891,449 →