Integrated circuit package device with improved bond pad connections, a lead-frame and an electronic device
View Patent ↗A semiconductor device package ( 10 ) with a substantially rectangular shape comprising: a die attach pad ( 12 ) having a top surface and a bottom surface; a plurality of contact pads ( 26 i - 26 n ) provided in at least four rows that correspond to the rectangular shape of the package, each contact pad having a top surface and a bottom surface; at least two tie bars ( 18 ) for supporting the die attach pad until the singulation of the package during manufacturing thereof the tie bars having a top surface and a bottom surface and extending from the die attach pad towards a corner of the package; —a semiconductor die ( 20 ) mounted on the top surface of the die attach pad ( 12 ) and having bonding pads ( 44 ) formed thereon; a plurality of electrical connections between selected ones of the bond pads ( 44 ) and corresponding ones of the contact pads ( 26 i - 26 n ); an encapsulation encapsulating the semiconductor die ( 20 ), the top surface of the die attach pad ( 12 ), the electrical connections, the top surface of the tie bars ( 18 ) and the top surfaces of the contact pads ( 26^2 On), and leaving the bottom surface of the die attach pad and the bottom surface of the contact pads exposed; characterized in that, at least one strip ( 30 ) having a top surface and a bottom surface is disposed between the die attach pad ( 12 ) and a corresponding row of contact pads, the strip having at least one lateral part ( 36 ) that is connected to at least one of the contact pads in said row, electrical connections being provided between the strip and selected bond pads ( 44 ) on the semiconductor die ( 20 ) adjacent to the strip.
1. A semiconductor device package with a substantially rectangular shape comprising:
a die attach pad having a top surface and a bottom surface;
a plurality of contact pads provided in at least four rows that correspond to the rectangular shape of the package, each contact pad having a top surface and a bottom surface;
at least two tie bars for supporting the die attach pad until the singulation of the package during manufacturing thereof, the tie bars having a top surface and a bottom surface and extending from the die attach pad towards a corner of the package;
a semiconductor die mounted on the top surface of the die attach pad and having bonding pads formed thereon;
a plurality of electrical connections between selected ones of the bond pads and corresponding ones of the contact pads;
an encapsulation encapsulating the semiconductor die, the top surface of the die attach pad, the electrical connections, the top surface of the tie bars and the top surfaces of the contact pads, and leaving the bottom surface of the die attach pad and the bottom surface of the contact pads exposed;
characterized in that, at least one strip having a top surface and a bottom surface is disposed between the die attach pad and a corresponding row of contact pads, the strip having at least one lateral part that is connected to a single contact pad of the contact pads in said row, electrical connections being provided between the strip and selected bond pads on the semiconductor die adjacent to the strip.
2. A semiconductor device package as claimed in claim 1 , characterized in that two strips are disposed between the die attach pad and a corresponding row of contact pads.
3. A semiconductor device package as claimed in 2 , characterized in that the strips are disposed adjacent to opposing sides of the die attach pad.
4. A semiconductor device package as claimed in claim 1 , characterized in that the bond pads on the semiconductor die that are electrically connected to a strip are used for power supply signals and or signals requiring a low ohmic connection, such as reference voltage signals or ground signals.
5. A semiconductor device package as claimed in claim 1 , characterized in that the strip comprises lateral parts that are connected to two contact pads in a corresponding row.
6. A semiconductor device package as claimed in claim 1 , characterized in that the bottom surface of the strip is exposed.
7. A semiconductor device package as claimed in claim 1 , characterized in that the electrical connections comprise wires that are bonded between the bond pads and the contact pads or the strips.
8. A leadframe that is used to manufacture a semiconductor device package as claimed in claim 1 .
9. An electronic device comprising an electronic carrier, such as a printed circuit board, on which a semiconductor device package as claimed in claim 1 is connected.
10. A semiconductor device package as claimed in claim 1 , characterized in that the at least two tie bars includes exactly two tie bars.
11. A semiconductor device package as claimed in claim 1 , characterized in that the plurality of contact pads includes exactly fifty contact pads.