Patent Assignment
Reel/Frame 028407/0179
Corrective Assignment to Correct Name of Conveying Parties Previously Recorded on Reel 026725, Frame 0852.
Recorded: 2012-06-14
Received: 2012-06-14
Pages: 16
Assignor
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(15)
Wirebonding Method and Apparatus
Application:
12/506,065 →
Integrated Circuit Package Device with Improved Bond Pad Connections, a Lead-Frame and an Electronic Device
Application:
11/817,019 →
Interconnections in Simd Processor Architectures
Application:
11/575,068 →
Method and System for Powering an Integrated Circuit
Application:
10/576,570 →
Intergrated Circuit with Dynamic Communication Service Selection
Application:
10/566,552 →
Hierarchical Memory Access via Pipelining with Deferred Arbitration
Application:
11/165,859 →
Coarse Delay Tuner Circuits with Edge Suppressors in Delay Locked Loops
Application:
10/538,378 →
Wirebonding Method and Apparatus
Application:
10/538,281 →
Data Carrier with a Module with a Reinforcement Strip
Application:
10/534,165 →
Version-Programmable Circuit Module
Application:
10/525,804 →
Lead-Frame Configuration for Chips
Application:
10/478,269 →
Processor Bus Arrangement
Application:
10/381,216 →
Folded-Flex Bondwire-Less Multichip Power Package
Application:
10/294,011 →
High Performance Chip/Package Inductor Integration
Application:
09/947,430 →
Integrated Circuit with Flash Memory Including Dedicated Flash Bus and Flash Bridge
Application:
09/891,449 →