IP Library › Assignment 019026/0356
Patent Assignment
Reel/Frame 019026/0356

Nunc Pro Tunc Assignment

Recorded: 2007-03-18 Pages: 3
Assignors
LIN, SHIH-HSIUNG
Executed: 2003-10-20
LIN, MOU-SHIUNG
Executed: 2003-10-20
Assignee
MEGIC CORPORATION
21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Circuit Component with Bump Formed Over Chip
Patent: 7,382,005 →
Application: 11/123,328 →
Publication: US 2005/0194695
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017600/0649 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →