Patent Assignment
Reel/Frame 019085/0218
Assignment of Assignor's Interest
Recorded: 2007-03-22
Pages: 3
Assignors
SAITO, KENICHIRO
Executed: 2006-12-22
YAZAWA, AKIHIRO
Executed: 2006-12-25
SASAKI, MASANORI
Executed: 2006-12-27
MITSUYA, TAKASHI
Executed: 2006-12-27
Assignee
EBARA CORPORATION
11-1, HANEDA ASAHI-CHO, OHTA-KU, TOKYO 144-8510, JAPAN
Covered Property
(1)
Polishing Apparatus and Substrate Processing Method