Assignment of Assignor's Interest

Recorded: 2007-04-06 Pages: 15

Assignors

AKRAM, SALMAN

Executed: 2004-12-30

WATKINS, CHARLES

Executed: 2004-12-23

HIATT, MARK

Executed: 2004-12-31

HEMBREE, DAVID

Executed: 2004-12-23

WARK, JAMES

Executed: 2004-12-27

FARNWORTH, WARREN

Executed: 2004-12-23

TUTTLE, MARK

Executed: 2004-12-29

RIGG, SIDNEY

Executed: 2004-12-23

OLIVER, STEVEN

Executed: 2004-12-23

KIRBY, KYLE

Executed: 2004-12-23

WOOD, ALAN

Executed: 2004-12-29

VELICKY, LU

Executed: 2004-12-27

Assignee

MICRON TECHNOLOGY, INC.

8000 S. FEDERAL WAY, BOISE, IDAHO, 83706-9632

Covered Property (1)

Through-Wafer Interconnects for Photoimager and Memory Wafers

Patent: 7,300,857 →

Application: 10/932,296 →

Publication: US 2006/0043599

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.