Patent Assignment
Reel/Frame 019158/0632
Assignment of Assignor's Interest
Recorded: 2007-03-27
Pages: 2
Assignor
FUJII, TOMOHARU
Executed: 2006-12-20
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Manufacturing Method of Wiring Substrate and Manufacturing Method of Semiconductor Device