Corrective Assignment to Correct the Execution Date of the Original Assignment Which Read 05-28-2005 Previously Recorded on Reel 018974 Frame 0701. Assignor(S) Hereby Confirms the Execution Date of Assignment Should Read 05-28-2006.

Recorded: 2007-04-13 Pages: 5

Assignor

OKADA, MASUAKI

Executed: 2006-05-28

Assignee

BONDTECH INC.

KEIHANNA PLAZA LABO-TO, 1-7, HIKARI-DAI, SEIKA-CHO, SORAKU-GUN, KYOTO, 6190237, JAPAN

Covered Property (1)

Bonding Method, Device Produced by This Method, and Bonding Device

Patent: 7,645,681 →

Application: 10/581,430 →

Publication: US 2007/0111471

Related Assignments (3)

Other recorded transfers of the patent in this record — the chain of ownership.