IP Library › Assignment 037124/0232
Patent Assignment
Reel/Frame 037124/0232

Change of Assignee Address

Recorded: 2015-11-17 Pages: 2
Assignor
BONDTECH INC.
Executed: 2015-11-09
Assignee
BONDTECH INC.
77, ISHIHARANISHIMACHI, KISSHOIN, MINAMI-KU, KYOTO, 601-8366, JAPAN
Covered Property (1)
Bonding Method, Device Produced by This Method, and Bonding Device
Patent: 7,645,681 →
Application: 10/581,430 →
Publication: US 2007/0111471
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 7, 2007
From: OKADA, MASUAKI
To: BONDTECH INC.
Reel/Frame 018974/0701 →
Corrective Assignment to Correct the Execution Date of the Original Assignment Which Read 05-28-2005 Previously Recorded on Reel 018974 Frame 0701. Assignor(S) Hereby Confirms the Execution Date of Assignment Should Read 05-28-2006. Apr 13, 2007
From: OKADA, MASUAKI
To: BONDTECH INC.
Reel/Frame 019160/0867 →
Change of Assignees Address Sep 8, 2010
From: BONDTECH INC.
To: BONDTECH INC.
Reel/Frame 024946/0800 →