Patent Assignment
Reel/Frame 019165/0340
Assignment of Assignor's Interest
Recorded: 2007-03-23
Pages: 11
Assignor
NEC CORPORATION
Executed: 2002-11-01
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property
(1)
Multilayer Interconnection Board, Semiconductor Device Having the Same, and Method of Forming the Same as Well as Method of Mounting the Semicondutor Chip on the Interconnection Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.