Patent Assignment
Reel/Frame 019195/0855
Assignment of Assignor's Interest
Recorded: 2007-04-23
Pages: 6
Assignors
UCHIDA, KENJI
Executed: 2007-01-31
HIRASAWA, KOKI
Executed: 2007-01-31
SHIMADA, KATSUMI
Executed: 2007-02-02
UENISHI, SHINJIRO
Executed: 2007-02-02
OTA, SHINYA
Executed: 2007-02-02
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI,, KANAGAWA, 211-8668, JAPAN
NITTO DENKO CORPORATION
2-1, SHIMOHOZUMI, 1-CHOME, IBARAKI-SHI,, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Transparent Epoxy Resin Composition for Molding Optical Semiconductor and Optical Semiconductor Integrated Circuit Device Using the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.