IP Library › Assignment 019198/0266
Patent Assignment
Reel/Frame 019198/0266

Assignment of Assignor's Interest

Recorded: 2007-04-24 Pages: 4
Assignors
SOGA, TASAO
Executed: 2007-04-02
KAWASE, DAISUKE
Executed: 2007-04-02
SUZUKI, KAZUHIRO
Executed: 2007-04-02
MORISAKI, EIICHI
Executed: 2007-04-02
SAITO, KATSUAKI
Executed: 2007-04-02
SHIMOKAWA, HANAE
Executed: 2007-04-05
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Semiconductor Power Module Including Epoxy Resin Coating
Patent: 8,004,075 →
Application: 11/739,122 →
Publication: US 2007/0246833
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 12, 2014
From: HITACHI, LTD.
To: HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
Reel/Frame 034153/0954 →
Change of Name Apr 30, 2025
From: HITACHI POWER SEMICONDUCTOR DEVICE LTD.
To: MINEBEA POWER SEMICONDUCTOR DEVICE INC.
Reel/Frame 071142/0232 →