Patent Assignment
Reel/Frame 019213/0383
Assignment of Assignor's Interest
Recorded: 2007-04-26
Pages: 4
Assignors
JUN, JUNG BAE
Executed: 2007-04-24
PARK, JIN GYU
Executed: 2007-04-25
LEE, HEUNG SE
Executed: 2007-04-25
Assignee
CHEIL INDUSTRIES, INC.
290, KONGDAN-DONG, KUMI-SHI, 730030, KOREA, REPUBLIC OF
Covered Property
(1)
Conductive Particles for Anisotropic Conductive Interconnection
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
Merger and Change of Name
Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest
Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →
Merger
Mar 26, 2025
From: KUKDO ADVANCED MATERIALS CO., LTD.
To: KUKDO CHEMICAL CO., LTD.
Reel/Frame 070646/0572 →