Patent Assignment
Reel/Frame 050640/0740
Assignment of Assignor's Interest
Recorded: 2019-10-07
Pages: 7
Assignor
SAMSUNG SDI CO., LTD.
Executed: 2019-09-24
Assignee
KUDKO CHEMICAL CO., LTD.
61, GASANDIGITAL 2-RO, GEUMCHEON-GU, SEOUL, 08588, KOREA, REPUBLIC OF
Covered Properties
(44)
Anisotropic Conductive Film Forming Composition
Insulated Conductive Particles and Anisotropic Conductive Adhesive Film Using the Same
Conductive Particles for Anisotropic Conductive Interconnection
Insulated Conductive Particles and Anisotropic Conductive Adhesive Film Containing the Particles
Polymer Particles, Conductive Particles, and an Anisotropic Conductive Packaging Materials Containing the Same
Polymer Particles and Conductive Particles Having Enhanced Conducting Properties, and Anisotropic Conductive Packaging Materials Containing the Same
Anisotropic Conductive Film Composition
Conductive Particles Comprising Complex Metal Layer With Density Gradient, Method for Preparing the Particles, and Anisotropic Conductive Adhesive Composition Comprising the Particles
Anisotropic Conductive Film Composition and Film Including the Same
Anisotropic Conductive Adhesive Composition, Anisotropic Conductive Film Comprising the Same, and Associated Methods
Anisotropic Conductive Film Composition, Anisotropic Conductive Film Including the Same, and Associated Methods
Adhesive Composition and Anisotropic Conductive Film Using the Same
Composition for Circuit Connection Film and Circuit Connection Film Using the Same
Anisotropic Conductive Adhesive Composite and Film, and Circuit Connecting Structure Including the Same
Anisotropic Conductive Film Composition
Electrical Connection Material and a Solar Cell Including the Same
Anisotropic Conductive Film, Composition for the Same, and Apparatus Including the Same
Optical Member Comprising Anisotropic Conductive Film
Anisotropic Conductive Film and Apparatus Including the Same
Semiconductor Device Using Composition for Anisotropic Conductive Adhesive Film or Anisotropic Conductive Adhesive Film
Anisotropic Conductive Film Composition and Semiconductor Device Bonded by the Same
Semiconductor Device Bonded by an Anisotropic Conductive Film
Electronic device using anisotropic conductive composition and film
Anisotropic Conductive Film Composition, Anisotropic Conductive Film, and Semiconductor Device Bonded by the Same
Anisotropic Conductive Film and Semiconductor Device Bonded by the Same
Semiconductor Device Using Composition for Anisotropic Conductive Adhesive Film or Anisotropic Conductive Adhesive Film
Anisotropic Conductive Film and Electronic Device Including the Same
Electronic Device
Semiconductor Device Connected by Anisotropic Conductive Film
Semiconductor Device Connected by Anisotropic Conductive Adhesive Film
Anisotropic Conductive Film, Composition for the Same, and Apparatus Including the Same
Anisotropic Conductive Film, Composition for the Same, and Apparatus Including the Same
Semiconductor Device Connected by Anisotropic Conductive Film
Semiconductor Device Connected by Anisotropic Conductive Film
Semiconductor Device Bonded by Anisotropic Conductive Film
Method of Manufacturing Semiconductor Device Including Thermal Compression
Semiconductor Device Connected by Anisotropic Conductive Film Having a Reliability Adhesive Strength
Semiconductor Device Connected by Anisotropic Conductive Film
Semiconductor Device Connected by Anisotropic Conductive Film
Semiconductor Device Connected by Anisotropic Conductive Film
Semiconductor Device Connected by Anisotropic Conductive Film
Display Device Connected by Anisotropic Conductive Film
Display Device Connected by Anisotropic Conductive Film
Composition for Anisotropic Conductive Film, Anisotropic Conductive Film, and Connection Structure Using the Same
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 14, 2005
From: JUNG, KI SUNG; KANG, JEONG KU; CHOI, JUNG SIK; LEE, JONG HWA
To: CHEIL INDUSTRIES, INC.
Reel/Frame 017248/0273 →
Assignment of Assignor's Interest
Mar 27, 2006
From: JUN, JUNG BAE; PARK, JIN GYU; LEE, JAE HO
To: CHEIL INDUSTRIES, INC.
Reel/Frame 017385/0690 →
Assignment of Assignor's Interest
Nov 10, 2006
From: PARK, JIN GYU; BAE, TAE SUB; JUN, JUNG BAE; LEE, JAE HO
To: CHEIL INDUSTRIES, INC.
Reel/Frame 018599/0793 →
Assignment of Assignor's Interest
Apr 26, 2007
From: JUN, JUNG BAE; PARK, JIN GYU; LEE, HEUNG SE
To: CHEIL INDUSTRIES, INC.
Reel/Frame 019213/0383 →
Assignment of Assignor's Interest
Jun 15, 2007
From: JUN, JUNG BAE; PARK, JIN GYU; LEE, JAE HO; BAE, TAE SUB
To: CHEIL INDUSTRIES INC.
Reel/Frame 019437/0129 →
Assignment of Assignor's Interest
Jul 26, 2007
From: JUN, JUNG BAE; PARK, JIN GYU; LEE, JAE HO; BAE, TAE SUB
To: CHEIL INDUSTRIES INC.
Reel/Frame 019612/0193 →
Assignment of Assignor's Interest
Dec 28, 2007
From: BAE, TAE SUB; PARK, JIN GYU; JUN, JUNG BAE; LEE, JAE HO
To: CHEIL INDUSTRIES INC.
Reel/Frame 020300/0871 →
Assignment of Assignor's Interest
Jan 8, 2008
From: KIM, HYOUN YOUNG; CHUNG, CHANG BUM; KANG, JEONG KU; CHOI, JUNG SIK
To: CHEIL INDUSTRIES, INC.
Reel/Frame 020357/0238 →
Assignment of Assignor's Interest
Apr 18, 2008
From: YOON, KANG BAE; PARK, KYOUNG SOO; LEE, CHEON SEOK
To: CHEIL INDUSTRIES, INC.
Reel/Frame 020853/0247 →
Assignment of Assignor's Interest
Sep 19, 2008
From: PARK, KYOUNG SOO; NAMKUNG, HYUN HEE; SHIN, KYOUNG HUN; JEON, BYEONG HWAN
To: CHEIL INDUSTRIES, INC.
Reel/Frame 021898/0858 →
Assignment of Assignor's Interest
Nov 7, 2008
From: KIM, HYOUN; UH, DONG SEON; KANG, JEONG KU; KIM, YOUNG HOON
To: CHEIL INDUSTRIES, INC.
Reel/Frame 021871/0951 →
Assignment of Assignor's Interest
Dec 18, 2008
From: JEON, BYEONG HWAN; PARK, KYOUNG SOO; KIM, BONG YONG; KWON, YOUNG JIN
To: CHEIL INDUSTRIES, INC.
Reel/Frame 022057/0591 →
Assignment of Assignor's Interest
Dec 10, 2009
From: NAMKUNG, HYUN HEE; PARK, KYOUNG SOO; KIM, BONG YONG; YOON, KANG BAE
To: CHEIL INDUSTRIES, INC.
Reel/Frame 023702/0660 →
Assignment of Assignor's Interest
Dec 21, 2010
From: LEE, GYU HO; PARK, YOUNG WOO; CHO, IL RAE; KIM, YOUNG HUN
To: CHEIL INDUSTRIES, INC.
Reel/Frame 025614/0889 →
Assignment of Assignor's Interest
Sep 16, 2011
From: BAE, SANG SIK; PARK, KYOUNG SOO; SHIN, KYOUNG HUN; YOON, KANG BAE
To: CHEIL INDUSTRIES, INC.
Reel/Frame 027062/0828 →
Assignment of Assignor's Interest
Sep 23, 2011
From: KO, YOUN JO; UH, DONG SEON; CHO, JANG HYUN; PARK, JIN SEONG
To: CHEIL INDUSTRIES, INC.
Reel/Frame 026957/0081 →
Merger and Change of Name
Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest
Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →
Merger
Mar 26, 2025
From: KUKDO ADVANCED MATERIALS CO., LTD.
To: KUKDO CHEMICAL CO., LTD.
Reel/Frame 070646/0572 →