IP Library Assignment 025614/0889
Patent Assignment
Reel/Frame 025614/0889

Assignment of Assignor's Interest

Recorded: 2010-12-21 Pages: 2
Assignors
LEE, GYU HO
Executed: 2010-12-20
PARK, YOUNG WOO
Executed: 2010-12-20
CHO, IL RAE
Executed: 2010-12-20
KIM, YOUNG HUN
Executed: 2010-12-20
PARK, KYOUNG SOO
Executed: 2010-12-20
PARK, JIN SEONG
Executed: 2010-12-20
UH, DONG SEON
Executed: 2010-12-20
LEE, KYUNG JIN
Executed: 2010-12-20
JUNG, KWANG JIN
Executed: 2010-12-20
Assignee
CHEIL INDUSTRIES, INC.
290, GONGDAN 2-DONG, GUMI-SI, GYEONGSANGBUK-DO, KOREA, REPUBLIC OF
Covered Property (1)
Anisotropic Conductive Adhesive Composite and Film, and Circuit Connecting Structure Including the Same
Patent: 9,035,192 →
Application: 12/974,476 →
Publication: US 2011/0155430
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
Merger and Change of Name Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →
Merger Mar 26, 2025
From: KUKDO ADVANCED MATERIALS CO., LTD.
To: KUKDO CHEMICAL CO., LTD.
Reel/Frame 070646/0572 →