Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same

1. An anisotropic conductive film, comprising:

a binder; and

conductive particles dispersed in the binder, each of the conductive particles including a copper core particle having silver metal directly contacting copper metal of the copper core particle, the silver metal being in a silver coating layer coated directly on a surface of the copper core particle, the silver coating layer having an island shape that exposes portions of the surface of the copper core particle and that covers other portions of the surface of the copper core particle,

wherein the conductive particles have an average particle size ranging from about 2 to about 20 μm.

2. The anisotropic conductive film as claimed in claim 1 , wherein:

the binder includes an organic resin, an amount of the organic resin being about 99.9 to 80 wt % based on a total weight of the anisotropic conductive film, and

an amount of the conductive particles is about 0.1 to 20 wt % based on the total weight of the anisotropic conductive film.

3. The anisotropic conductive film as claimed in claim 1 , wherein a total amount of the silver coating layer is about 8 wt % to about 9 wt % based on a total weight of the conductive particles.

4. The anisotropic conductive film as claimed in claim 1 , wherein the copper core particle is formed by chemical precipitation.

5. The anisotropic conductive film as claimed in claim 1 , wherein the copper core particle is formed by atomizing.

6. The anisotropic conductive film as claimed in claim 1 , wherein each of the conductive particles includes a rust protection layer directly on the exposed portions of the surface of the copper core particle and directly on a surface of the silver coating layer that covers the other portions of the surface of the copper core particle, the rust protection layer being formed by a rust protection treatment including stearic acid.

7. An anisotropic conductive adhesive composite, comprising:

a binder; and

conductive particles dispersed in the binder, each of the conductive particles including a copper core particle having silver metal directly contacting copper metal of the copper core particle, the silver metal being in a silver coating layer coated directly on a surface of the copper core particle, the silver coating layer having an island shape that exposes portions of the surface of the copper core particle and that covers other portions of the surface of the copper core particle,

wherein the conductive particles have an average particle size ranging from about 2 to about 20 μm.

8. The anisotropic conductive adhesive composite as claimed in claim 7 , wherein each of the conductive particles includes a rust protection layer directly on the exposed portions of the surface of the copper core particle and directly on a surface of the silver coating layer that covers the other portions of the surface of the copper core particle, the rust protection layer being formed by a rust protection treatment including stearic acid.

9. The anisotropic conductive adhesive composite as claimed in claim 7 , the island shape being formed through electroless plating.

10. The anisotropic conductive adhesive composite as claimed in claim 9 , wherein a total amount of the silver coating layer is about 8 wt % to about 9 wt % based on a total weight of the conductive particles.

11. A circuit connection structure, comprising:

a circuit substrate including a circuit electrode;

a wire substrate facing the circuit substrate and including a wire electrode; and

an anisotropic conductive film as claimed in claim 1 , the anisotropic conductive film being configured to provide an electrical connection between the circuit electrode and the wire electrode.

12. The circuit connection structure as claimed in claim 11 , wherein the wire electrode includes copper corresponding to the copper core particle.

13. The circuit connection structure as claimed in claim 11 , wherein the circuit electrode includes silver (Ag), tin (Sn), gold (Au), titanium (Ti), molybdenum (Mo), aluminum (Al) or bismuth (Bi) corresponding to the metal coating layer, and the metal coating layer includes silver (Ag), tin (Sn), gold (Au), titanium (Ti), molybdenum (Mo), aluminum (Al) or bismuth (Bi) corresponding to the circuit electrode.

14. The circuit connection structure as claimed in claim 11 , wherein the wire electrode includes copper, and the circuit electrode includes silver, such that at least one copper core particle is adhered to the wire electrode and at least one silver coating layer is adhered to the circuit electrode.

15. The circuit connection structure as claimed in claim 11 , wherein a total amount of the silver in the silver coating layer is about 8 wt % to about 9 wt % based on a total weight of the conductive particles.

16. The circuit connection structure as claimed in claim 11 , wherein at least one conductive particle is disposed between the circuit electrode and the wire electrode, and the copper core particle of the at least one conductive particle is deformed.

17. The anisotropic conductive adhesive composite as claimed in claim 7 , wherein each of the conductive particles includes a rust protection layer directly on the exposed portions of the surface of the copper core particle and directly on a surface of the silver coating layer that covers the other portions of the surface of the copper core particle, the rust protection layer being formed by a rust protection treatment including using an organic material as a reactant to form the rust protection layer.

18. The anisotropic conductive adhesive composite as claimed in claim 7 , wherein the binder is included in an amount of about 99.9 to 80 wt %, based on a total weight of the anisotropic conductive adhesive composite.

19. The circuit connection structure as claimed in claim 11 , wherein the silver coating layer consists essentially of silver.