Patent Assignment
Reel/Frame 023702/0660
Assignment of Assignor's Interest
Recorded: 2009-12-10
Pages: 2
Assignors
NAMKUNG, HYUN HEE
Executed: 2009-12-10
PARK, KYOUNG SOO
Executed: 2009-12-10
KIM, BONG YONG
Executed: 2009-12-10
YOON, KANG BAE
Executed: 2009-12-10
BAE, SANG SIK
Executed: 2009-12-10
SEO, HYUN JOO
Executed: 2009-12-10
Assignee
CHEIL INDUSTRIES, INC.
290, GONGDAN-DONG, GUMI-SI, KYEONGSANGBUK-DO, 730-030, KOREA, REPUBLIC OF
Covered Property
(1)
Composition for Circuit Connection Film and Circuit Connection Film Using the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
Merger and Change of Name
Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest
Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →