Composition for circuit connection film and circuit connection film using the same
A composition for a circuit connection film and a circuit connection film using the same, the composition including a binder resin including an acrylate modified urethane resin, a carboxyl modified acrylonitrile butadiene rubber, and an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group, and an organic peroxide.
1. A composition for a circuit connection film, comprising:
a binder resin including:
an acrylate modified urethane resin,
a carboxyl modified acrylonitrile butadiene rubber, and
an acrylic copolymer, the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g;
a radical polymerizable compound including at least one of an isocyanurate acrylate compound and a compound having a (meth)acrylate group; and
an organic peroxide.
2. The composition as claimed in claim 1 , wherein the composition includes:
100 parts by weight of the binder resin, the binder resin including:
about 45 to about 75 wt. % of the acrylate modified urethane resin,
about 5 to about 25 wt. % of the carboxyl modified acrylonitrile butadiene rubber, and
about 5 to about 30 wt. % of the acrylic copolymer having an acid value of about 1 to about 100 mg KOH/g, all based on the weight of the binder resin;
about 18 to about 32 parts by weight of the radical polymerizable compound including at least one of the isocyanurate acrylate compound and the compound with a (meth)acrylate group; and
about 1.5 to about 15 parts by weight of the organic peroxide.
3. The composition as claimed in claim 2 , wherein the radical polymerizable compound includes the isocyanurate acrylate compound and the compound with a (meth)acrylate group, a weight ratio of the isocyanurate acrylate compound to the compound with a (meth)acrylate group being about 1:2 to about 2:1.
4. The composition as claimed in claim 1 , wherein:
the acrylate modified urethane resin includes a diisocyanate, a polyol, a diol and an acrylate,
a mole ratio of a diisocyanate group (NCO) to a hydroxyl group (OH) among the diisocyanate, polyol, and diol is about 1.04 to about 1.6, and
the acrylate modified urethane resin has a polyol content of about 70% or less.
5. The composition as claimed in claim 1 , wherein:
the acrylate modified urethane resin has a weight-average molecular weight of about 1,000 to about 50,000,
the acrylate modified urethane resin has at least one acrylate terminal functional group, and
the acrylate modified urethane resin has a glass transition temperature (Tg) of about 0° C. or higher.
6. The composition as claimed in claim 1 , wherein:
the carboxyl modified acrylonitrile butadiene rubber has a weight-average molecular weight of about 2,000 to about 200,000,
the carboxyl modified acrylonitrile butadiene rubber has an acrylonitrile content of about 10 to about 60 wt. %, and
the carboxyl modified acrylonitrile butadiene rubber has a carboxyl content of about 1 to about 20 wt. %.
7. The composition as claimed in claim 1 , wherein the radical polymerizable compound includes the isocyanurate acrylate compound, the isocyanurate acrylate compound having a DSC heating peak of about 85 to about 95° C.
8. The composition as claimed in claim 7 , wherein the isocyanurate acrylate compound has a DSC heating peak of about 92 to about 95° C.
9. The composition as claimed in claim 1 , wherein the isocyanurate acrylate compound includes at least one of isocyanuric acid ethylene oxide modified diacrylate and tris(2-hydroxyethyl)isocyanurate triacrylate.
10. The composition as claimed in claim 1 , wherein the radical polymerizable compound includes the compound with a (meth)acrylate group, the compound with a (meth)acrylate group including a (meth)acrylate oligomer and a (meth)acrylate monomer.
11. The composition as claimed in claim 10 , wherein the (meth)acrylate oligomer includes at least one of urethane (meth)acrylate, epoxy (meth)acrylate, polyester (meth)acrylate, fluorine (meth)acrylate, fluorene (meth)acrylate, silicon (meth)acrylate, phosphorus (meth)acrylate, maleimide modified (meth)acrylate, and acrylate (methacrylate).
12. The composition as claimed in claim 10 , wherein the (meth)acrylate monomer includes at least one of 1,6-hexanediol mono(meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (metha)crylate, 2-hydroxy-3-phenyloxypropyl (meth)acrylate, 1,4-butanediol (meth)acrylate, 2-hydroxyalkyl (meth)acryloyl phosphate, 4-hydroxycyclohexyl (meth)acrylate, neopentylglycol mono(meth)acrylate, trimethylolethane di(meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol hexa(meth)acrylate, glycerol di(meth)acrylate, t-hydrofurfuryl (meth)acrylate, isodecyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, isobonyl (meth)acrylate, tridecyl (meth)acrylate, ethoxylated nonylphenol (meth)acrylate, ethyleneglycol di(meth)acrylate, diethyleneglycol di(meth)acrylate, triethyleneglycol di(meth)acrylate, t-ethyleneglycol di(meth)acrylate, polyethyleneglycol di(meth)acrylate, 1,3-butyleneglycol di(meth)acrylate, tripropyleneglycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, cyclohexanedimethanol di(meth)acrylate, phenoxy-t-glycol (meth)acrylate, 2-methacryloyloxyethyl phosphate, dimethylol tricyclodecane di(meth)acrylate, trimethylol-propanebenzoate acrylate, fluorene (meth)acrylate, and acid phosphoxyethyl methacrylate.
13. The composition as claimed in claim 10 , wherein at least one of the (meth)acrylate oligomer and the (meth)acrylate monomer includes at least one of a fluorene epoxy (meth)acrylate and a fluorene urethane (meth)acrylate, the at least one fluorene epoxy (meth)acrylate and fluorene urethane (meth)acrylate having a fluorene structure represented by the following Chemical Formula 1:
wherein R is an alkyl, alkoxy, aryl, or cycloalkyl group, m is an integer from 0 to 4, and n is an integer from 2 to 5.
14. The composition as claimed in claim 1 , wherein the organic peroxide includes at least one of t-butylperoxylaurate, 1,1,3,3-t-methylbutyl peroxy-2-ethylhexanonate, 2,5-dimethyl-2,5-di(2-ethylhexanoyl peroxy)hexane, 1-cyclohexyl-1-methylethyl peroxy-2-ethylhexanonate, 2,5-dimethyl-2,5-di(m-toluoylperoxy)hexane, t-butyl peroxyisopropylmonocarbonate, t-butyl peroxy-2-ethylhexylmonocarbonate, t-hexyl peroxybenzoate, t-butyl peroxyacetate, dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylcumylperoxide, t-hexyl peroxyneodecanoate, t-hexylperoxy-2-ethylhexanonate, t-butylperoxy-2-2-ethylhexanonate, t-butylperoxyisobutyrate, 1,1-bis(t-butylperoxy)cyclohexane, t-hexyl peroxyisopropylmonocarbonate, t-butylperoxy-3,5,5-trimethylhexanonate, t-butylperoxypivalate, cumylperoxy-neodecanoate, diisopropylbenzenehydroperoxide, cumene hydroperoxide, isobutylperoxide, 2,4-dichlorobenzoylperoxide, 3,5,5-trimethylhexanoylperoxide, octanoylperoxide, lauroylperoxide, stearoylperoxide, succinic peroxide, benzoylperoxide, 3,5,5-trimethylhexanoylperoxide, benzoylperoxytoluene, 1,1,3,3-tetramethylbutylperoxyneodecanoate, 1-cyclohexyl-1-methylethylperoxyneodecanoate, di-n-propylperoxydicarbonate, diiso-propylperoxycarbonate, bis(4-t-butylcyclohexyl) peroxydicarbonate, di-2-ethoxymethoxyperoxydicarbonate, di(2-ethylhexylperoxy)dicarbonate, dimethoxy-butylperoxydicarbonate, di(3-methyl-3-methoxybutylperoxy)dicarbonate, 1,1-bis(t-hexylperoxy)-3,3,5-trimethylcyclohexane, 1,1-bis(t-hexylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, 1,1-(t-butylperoxy)cyclododecane, 2,2-bis(t-butylperoxy)decane, t-butyltrimethylsilylperoxide, bis(t-butyl)dimethylsilylperoxide, t-butyltriallylsilylperoxide, bis(t-butyl)diallylsilylperoxide, and tris(t-butyl)allylsilylperoxide.
15. The composition as claimed in claim 1 , further comprising:
about 5 to about 13 parts by weight of conductive particles with respect to 100 parts by weight of the binder resin, the conductive particles including at least one of:
metal particles including at least one of Au, Ag, Ni, Cu, and solder,
carbon, and
a resin including polyethylene, polypropylene, polyester, polystyrene and polyvinyl alcohol and a modification thereof which are coated with metal including at least one of Au, Ag, and Ni.
16. A circuit connection film, comprising:
the composition as claimed in claim 1 , the film having:
a DSC heating peak temperature of about 92 to about 95° C. when measured by a differential scanning calorimeter (DSC) at a temperature range of 50 to 220° C. and a temperature increase rate of 10° C./min, and
an acid value of about 5 to about 30 mg KOH/g.