Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
An anisotropic conductive film composition for bonding an electronic device may include a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2: where n may be an integer from 1 to about 50.
1. A semiconductor device bonded by an anisotropic conductive film composition, the anisotropic conductive film composition comprising:
a first component that includes one or more selected from the group of a hydrogenated bisphenol A epoxy monomer represented by Formula 1 and a hydrogenated bisphenol A epoxy oligomer represented by Formula 2:
wherein n is an integer from 1 to about 50;
a sulfonium curing agent;
a binder resin; and
conductive particles.
2. The semiconductor device as claimed in claim 1 , wherein the first component includes the hydrogenated bisphenol A epoxy monomer represented by Formula 1 and the hydrogenated bisphenol A epoxy oligomer represented by Formula 2.
3. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film composition includes:
about 1 to about 50 parts by weight of the first component;
about 1 to about 20 parts by weight of the sulfonium curing agent;
about 20 to about 60 parts by weight of the binder resin; and
about 10 to about 50 parts by weight of the conductive particles;
based on 100 parts by weight of the anisotropic conductive film composition.
4. The semiconductor device as claimed in claim 1 , wherein the sulfonium curing agent includes an aromatic sulfonium salt.
5. The semiconductor device as claimed in claim 4 , wherein the aromatic sulfonium salt is represented by Formula 3:
wherein:
R 1 is selected from the group of hydrogen, an alkyl group, an alkoxy group, a methoxy carbonyl group, and an ethoxy carbonyl group;
R 2 is selected from the group of a methyl group, an ethyl group, a propyl group, and a butyl group; and
R 3 is selected from the group of a nitrobenzyl group, a dinitrobenzyl group, a trinitrobenzyl group, and a naphthylmethyl group.
6. The semiconductor device as claimed in claim 1 , wherein the sulfonium curing agent includes a sulfonium salt represented by Formula 4:
wherein R 1 is selected from the group of a benzyl group, a substituted benzyl group, a phenacyl group, a substituted phenacyl group, an alkyl group, a substituted alkyl group, an alkoxy group, a substituted alkoxy group, an aryloxy group, and a substituted aryloxy group;
R 2 and R 3 each independently are selected from the group of a benzyl group, a substituted benzyl group, a phenacyl group, a substituted phenacyl group, an alkyl group, a substituted alkyl group, an alkoxy group, a substituted alkoxy group, an aryloxy group, a substituted aryloxy group, fluorine, chlorine, bromine, a hydroxyl group, a carboxyl group, a mercapto group, a cyano group, a nitro group, a C 1 to C 18 straight, branched, or cyclic alkyl group, and a substituted C 1 to C 18 straight, branched, or cyclic alkyl group; and
R 1 and R 2 , R 1 and R 3 , or R 2 and R 3 optionally are combined with each other into a cyclic structure.
7. The semiconductor device as claimed in claim 4 , wherein the aromatic sulfonium salt is represented by Formula 5:
wherein:
R 1 is selected from the group of a hydroxyl group,
R 5 O—,
R 5 is selected from the group of an aromatic hydrocarbon, a substituted aromatic hydrocarbon, an aliphatic hydrocarbon, a substituted aliphatic hydrocarbon, a carboxyl group, a sulfonyl group, and combinations thereof; and
R 2 is selected from the group of hydrogen and C 1 to C 6 alkyl groups.
8. The semiconductor device as claimed in claim 1 , wherein the sulfonium curing agent includes:
9. The semiconductor device as claimed in claim 1 , wherein the binder resin includes an epoxy resin having at least two epoxy groups and having an epoxy equivalent weight of about 90 g/eq to about 5,000 g/eq.
10. The semiconductor device as claimed in claim 1 , wherein the binder resin has a weight average molecular weight of about 5,000 g/mol to about 150,000 g/mol.
11. The semiconductor device as claimed in claim 1 , wherein the binder resin includes a fluorene epoxy resin.
12. The semiconductor device as claimed in claim 1 , wherein the conductive particles include at least one selected from the group of metal particles and organic or inorganic particles coated with a metal.
13. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film composition provides a glass transition temperature of about 120° C. or more.
14. The semiconductor device as claimed in claim 1 , wherein the anisotropic conductive film composition is for a chip-on-glass (COG) device.
15. An semiconductor device, comprising:
a wiring substrate, the wiring substrate including glass; and
an electrical element bonded to the wiring substrate by an anisotropic conductive film that is a cured product of the anisotropic conductive film composition as according to claim 1 .
16. A semiconductor device bonded by an anisotropic conductive film formed from a composition, the composition comprising:
a hydrogenated bisphenol A epoxy monomer represented by Formula 1 or a hydrogenated bisphenol A epoxy oligomer represented by Formula 2:
wherein n is an integer from 1 to about 50,
the anisotropic conductive film having:
a curing rate of about 70% or more when cured at about 150 to about 170° C. for about 5 to about 10 seconds, and
a glass transition temperature of about 120° C. or more.
17. The semiconductor device as claimed in claim 16 , wherein the curing rate of the anisotropic conductive film is about 70% or more when cured at about 150° C. for about 5 to 10 seconds.
18. The semiconductor device as claimed in claim 16 , wherein the anisotropic conductive film bonds a chip-on-glass (COG) device.