Anisotropic conductive film composition

1. An anisotropic conductive film (ACF) composition having adhesive property, comprising:

a binder including a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin;

a curing composition; and

conductive particles,

wherein the curing composition includes:

at least one (meth)acrylate oligomer,

at least one (meth)acrylate monomer, and

at least one radical initiator.

2. The ACF composition as claimed in claim 1 , wherein:

the thermoplastic resin is in an amount of about 5 wt % to 50 wt % by weight of the ACF composition,

the SAN copolymer resin is in an amount of about 5 wt % to about 50 wt % by weight of the ACF composition,

the (meth)acrylate oligomer is in an amount of about 1 wt % to about 50 wt % by weight of the ACF composition,

the (meth)acrylate monomer is in an amount of about 1 wt % to about 30 wt % by weight of the ACF composition,

the radical initiator is in an amount of about 0.1 wt % to about 15 wt % by weight of the ACF composition, and

the conductive particles are in an amount of about 0.01 wt % to about 20 wt % by weight of the ACF composition.

3. The ACF composition as claimed in claim 1 , wherein the (meth)acrylate oligomer has an average molecular weight of 1,000 to about 100,000, and includes one or more of a urethane-based (meth)acrylate, an epoxy-based (meth)acrylate, a polyester-based (meth)acrylate, a fluorine-based (meth)acrylate, a fluorene-based (meth)acrylate, a silicon-based (meth)acrylate, a phosphate-based (meth)acrylate, a maleimide modified (meth)acrylate, and/or an acrylate-methacrylate.

4. The ACF composition as claimed in claim 1 , wherein the (meth)acrylate monomer includes one or more of 1,6-hexanediol mono(meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 2-hydroxy-3-phenyloxypropyl (meth)acrylate, 1,4-butanediol (meth)acrylate, 2-hydroxyalkyl (meth)acryloyl phosphate, 4-hydroxy cyclohexyl (meth)acrylate, neopentylglycol mono(meth)acrylate, trimethylolethane di(meth)acrylate, trimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol hexa(meth)acrylate, glycerine di(meth)acrylate, t-hydroperfuryl (meth)acrylate, isodecyl (meth)acrylate, 2-(2-ethoxyethoxy) ethyl (meth)acrylate, stearyl (meth)acrylate, lauryl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, isobonyl (meth)acrylate, tridecyl (meth)acrylate, ethoxylated nonylphenol (meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, t-ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, ethoxylated bisphenol-A di(meth)acrylate, cyclohexanedimethanol di(meth)acrylate, phenoxy-t-glycol (meth)acrylate, 2-methacryloyloxyethyl phosphate, dimethylol tricyclodecane di(meth)acrylate, trimethylolpropane benzoate acrylate, and/or fluorene-based (meth)acrylate.

5. The ACF composition as claimed in claim 1 , wherein the (meth)acrylate oligomer and/or the (meth)acrylate monomer includes a fluorene-based (meth)acrylate.

6. The ACF composition as claimed in claim 5 , wherein the (meth)acrylate oligomer and/or the (meth)acrylate monomer includes a fluorene-based epoxy (meth)acrylate represented by formula (2) below,

wherein each of R 1 and R 2 is independently hydrogen or methyl, each n is independently an integer from 0 to 15, and each m is independently an integer from 2 to 4, or a fluorene-based urethane (meth)acrylate represented by formula (3) below,

wherein each of R 1 and R 4 is independently hydrogen or methyl, each of R 2 and R 3 is independently a C 1-20 aliphatic or C 5-20 alicyclic or aromatic group, each n is independently an integer from 1 to 5, and each m is independently an integer from 2 to 5.

7. The ACF composition as claimed in claim 1 , wherein the radical initiator is a light curing initiator or a heat curing initiator.

8. The ACF composition as claimed in claim 1 , further comprising at least one additive in an amount of about 0.1 wt % to about 10 wt % by weight of the ACF composition, the additive being one or more of a polymerization inhibitor, an antioxidant, a heat stabilizer, and/or a curing accelerator.

9. The ACF composition as claimed in claim 1 , wherein the SAN copolymer resin has a glass transition temperature of about 100 ° C. to about 200 ° C.

10. The ACF composition as claimed claim 1 , wherein the SAN copolymer resin has an average molecular weight of about 5,000 to about 200,000.

11. The ACF composition as claimed in claim 1 , wherein the thermoplastic resin has an average molecular weight of about 1,000 to about 1,000,000 and includes one or more of an acrylonitrile-based resin, a butadiene-based resin, an acryl-based resin, a urethane-based resin, an epoxy based resin, a phenoxy-based resin, a polyamide-based resin, an olefin-based resin, and/or a silicon-based resin.

12. The ACF composition as claimed in claim 1 , wherein the conductive particles include metal particles, crystalline carbon particles, amorphous carbon particles, metal coated polymeric particles, and/or insulation-coated conductive particles.

13. A method of manufacturing an anisotropic conductive film (ACF) composition having adhesive property, the method comprising:

forming a binder including a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin; and

combining a curing composition and conductive particles with the binder,

wherein the curing composition includes:

at least one (meth)acrylate oligomer,

at least one (meth)acrylate monomer, and

at least one radical initiator.