Anisotropic conductive film composition
An anisotropic conductive film (ACF) composition includes a binder having a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles.
1. An anisotropic conductive film (ACF) composition, comprising:
a binder including a thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin;
a curing composition; and
conductive particles, wherein:
the curing composition includes:
at least one epoxy component, and
at least one heat curing agent.
2. The ACF composition as claimed in claim 1 , wherein:
the thermoplastic resin is in an amount of about 5 wt % to about 50 wt % by weight of the ACF composition,
the SAN copolymer resin is in an amount of about 5 wt % to about 50 wt % by weight of the ACF composition,
the epoxy component is in an amount of about 1 wt % to about 80 wt % by weight of the ACF composition,
the heat curing agent is in an amount of about 0.1 wt % to about 15 wt % by weight of the ACF composition; and
the conductive particles are in an amount of about 0.01 wt % to about 20 wt % by weight of the ACF composition.
3. The ACF composition as claimed in claim 1 , wherein the epoxy component includes one or more of a bisphenol epoxy, a novolac epoxy, a glycidyl epoxy, an aliphatic epoxy, and/or an alicyclic epoxy.
4. The ACF composition as claimed in claim 1 , wherein the epoxy component includes at least one or more of a solid-phase epoxy, a liquid-phase epoxy, and/or a soluble epoxy.
5. The ACF composition as claimed in claim 1 , wherein the heat curing agent includes one or more of an acid anhydride-based compound, an amine-based compound, an imidazole-based compound, and/or a hydrazide-based compound.