Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less.
1. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having:
a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40,
wherein the polymer binder system includes an acrylic acid ester copolymer, and the curing system includes a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate, and
wherein the anisotropic conductive adhesive film has:
a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less, and
a minimum modulus before curing of 1×10 4 gf/cm 2 or more.
2. The display device as claimed in claim 1 , wherein a total amount of the bisphenol fluorene diacrylate and the isocyanuric acid ethylene oxide modified diacrylate is about 25 to about 50 wt % based on a total amount of the anisotropic conductive adhesive composition in terms of solid content.
3. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition comprising:
an acrylic acid ester copolymer;
at least one selected from the group of a styrene-acrylonitrile resin, an acrylonitrile butadiene rubber, a urethane acrylate resin, an ester urethane resin, and a urethane resin other than the urethane acrylate resin and the ester urethane resin;
an isocyanuric acid ethylene oxide modified diacrylate; and
a bisphenol fluorene diacrylate,
the anisotropic conductive adhesive film having a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.
4. The display device as claimed in claim 3 , wherein the styrene-acrylonitrile resin, the acrylonitrile butadiene rubber, the urethane acrylate resin, the ester urethane resin and the urethane resin other than the urethane acrylate resin and the ester urethane resin have a glass transition temperature (Tg) of about 100° C. or higher.
5. The display device as claimed in claim 3 , wherein a total amount of the bisphenol fluorene diacrylate and the isocyanuric acid ethylene oxide modified diacrylate is about 25 to about 50 wt % based on a total amount of the anisotropic conductive adhesive composition in terms of solid content.
6. The display device as claimed in claim 3 , wherein the anisotropic conductive adhesive composition further comprises a (meth)acrylate group containing compound, an organic peroxide, and conductive particles.
7. The display device as claimed in claim 6 , wherein the anisotropic conductive adhesive composition comprises:
about 20 to about 40 wt % of the acrylic acid ester copolymer;
about 1 to about 20 wt % of the at least one selected from the group of the styrene-acrylonitrile resin, the acrylonitrile butadiene rubber, the urethane acrylate resin, the ester urethane resin and the urethane resin other than the urethane acrylate resin and the ester urethane resin;
about 5 to about 25 wt % of the isocyanuric acid ethylene oxide modified diacrylate;
about 5 to about 25 wt % of the bisphenol fluorene diacrylate;
about 1 to about 5 wt % of the (meth)acrylate group containing compound;
about 1 to about 10 wt % of the organic peroxide; and
about 1 to about 10 wt % of the conductive particles, based on a total amount of the anisotropic conductive adhesive composition in terms of solid content.
8. A display device, comprising:
an anisotropic conductive adhesive film having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40; and
an electrode having a height of about 25 μm or more bonded by the anisotropic conductive adhesive film,
wherein the polymer binder system includes an acrylic acid ester copolymer, and the curing system includes a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate, and
wherein the anisotropic conductive adhesive film has a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.
9. The display device as claimed in claim 8 , wherein the anisotropic conductive adhesive film has a connection time of about 5 seconds or less at about 160 to about 200° C.
10. The display device as claimed in claim 8 , wherein the anisotropic conductive adhesive film has a bubble area of about 5% or less based on a total area of the anisotropic conductive adhesive film.
11. The display device as claimed in claim 8 , wherein the display device comprises a film on glass form, and the anisotropic conductive adhesive film is bonded to the glass.
12. A display device bonded by an anisotropic conductive adhesive film, the anisotropic conductive adhesive film having an adhesive strength decreasing rate calculated by Equation 1 of greater than 0 and about 40% or less, a connection resistance increasing rate calculated by Equation 2 of greater than 0 and about 20% or less, and having a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more:
Adhesive strength decreasing rate (%)=|( A−B )/ A|× 100 Equation 1:
Connection resistance increasing rate (%)=|( C−D )/ C|× 100, Equation 2:
where, in Equation 1, A is an adhesive strength after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, B is an adhesive strength after the preliminary pressing, the final pressing, and then reliability testing at 85° C. and 85% RH for 250 hours, and
in Equation 2, C is a connection resistance after preliminary pressing at 80° C. and 1 MPa for 1 second and final pressing at 180° C. and 3 MPa for 5 seconds, and D is a connection resistance after the preliminary pressing, the final pressing, and then reliability testing at 85° C. and 85% RH for 250 hours,
wherein:
the anisotropic conductive adhesive film includes a polymer binder system and a curing system,
the polymer binder system includes an acrylic acid ester copolymer, and
the curing system includes a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate.
13. The display device as claimed in claim 12 , wherein the anisotropic conductive adhesive film has an adhesive strength of about 700 gf/cm or more after the reliability testing and a connection resistance of about 2.5Ω or less after the reliability testing.
14. The display device as claimed in claim 12 , wherein the anisotropic conductive adhesive film has a minimum modulus when cured of about 1×10 6 gf/cm 2 or more while elevating a temperature at 10° C./min from 30 to 250° C.
15. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a total amount of a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate of about 25 to about 50 wt % based on a total amount of the anisotropic conductive adhesive composition in terms of solid content, the anisotropic conductive adhesive film having a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.
16. A display device bonded by an anisotropic conductive adhesive film formed from an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including:
a polymer binder system, the polymer binder system including an acrylic acid ester copolymer; and
a curing system, the curing system including a bisphenol fluorene diacrylate and an isocyanuric acid ethylene oxide modified diacrylate,
wherein the anisotropic conductive adhesive film has a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less and a minimum modulus before curing of 1×10 4 gf/cm 2 or more.