Optical member comprising anisotropic conductive film
An optical member includes an anisotropic conductive film that has a multilayer structure having a bonding layer containing an epoxy resin as a curing part and a bonding layer containing a (meth)acrylate resin as a curing part.
1. An optical member, comprising:
an anisotropic conductive film that has an adhesion decrease rate of more than 0 to about 30%, the adhesion decrease rate being represented by Equation 1:
Adhesion decrease rate (%)=|( B−A )/ A|× 100, [Equation 1]
where A represents adhesion after pressing at 160° C. and 3 MPa for 3 seconds, and B represents adhesion after pressing at 160° C. and 3 MPa for 3 seconds and storage at 85° C. and at 85 RH % for 250 hours,
wherein:
the anisotropic conductive film includes a double-layer structure formed of: a first bonding layer containing an epoxy resin as a curing part and an epoxy (meth)acrylate, and a second bonding layer containing a (meth)acrylate resin as a curing part and an epoxy (meth)acrylate, wherein the first bonding layer is attached to glass, and the second bonding layer is attached to a non-glass substrate or chip,
the anisotropic conductive film has an onset temperature of about 80 to about 90° C. and a peak temperature of about 95 to about 110° C. as measured using a differential scanning calorimetry, and
the second bonding layer includes, in terms of solid content:
about 25 to about 63 wt % of a urethane-modified acrylate resin,
about 15 to about 30 wt % of an epoxy (meth)acrylate,
15 to about 20 wt % of an isocyanurate (meth)acrylate,
about 5 to 12 wt % of a (meth)acrylate group containing compound,
about 1 to about 10 wt % of a polymerization initiator, and
about 1 to about 10 wt % of conductive particles.
2. The optical member as claimed in claim 1 , wherein the first bonding layer includes:
an epoxy resin not comprising (meth)acrylate,
the epoxy (meth)acrylate,
a latent curing agent,
conductive particles, and
a silane coupling agent.
3. The optical member as claimed in claim 2 , wherein the first bonding layer includes, in terms of solid content:
about 15 to about 59.9% by weight (wt %) of the epoxy resin,
about 10 to about 30 wt % of the epoxy (meth)acrylate,
about 29 to about 40 wt % of the latent curing agent,
about 1 to about 10 wt % of the conductive particles, and
about 0.1 to about 5 wt % of the silane coupling agent.
4. The optical member as claimed in claim 2 , wherein the epoxy resin includes a bisphenol epoxy resin and an aromatic epoxy resin.
5. The optical member as claimed in claim 4 , wherein the epoxy resin includes about 30 to about 80 wt % of the bisphenol epoxy resin and about 20 to about 70 wt % of the aromatic epoxy resin.
6. The optical member as claimed in claim 1 , wherein the second bonding layer further includes a silane coupling agent.
7. The optical member as claimed in claim 1 , wherein the double-layer structure has a thickness of about 5 to about 50 μm, and each of the first and second bonding layers has a thickness of about 1 to about 30 μm.
8. The optical member as claimed in claim 1 , wherein at least one of the epoxy (meth)acrylates includes BPA epoxy (meth)acrylate, novolac epoxy (meth)acrylate, or di(meth)acrylate of diglycidyl ether of propylene oxide modified BPA.
9. The optical member as claimed in claim 1 , wherein at least one of the epoxy (meth)acrylates includes di(meth)acrylate of diglycidyl ether of propylene oxide modified BPA.