Patent Assignment
Reel/Frame 020300/0871
Assignment of Assignor's Interest
Recorded: 2007-12-28
Pages: 6
Assignors
BAE, TAE SUB
Executed: 2007-12-21
PARK, JIN GYU
Executed: 2007-12-21
JUN, JUNG BAE
Executed: 2007-12-21
LEE, JAE HO
Executed: 2007-12-21
PARK, JUNG IL
Executed: 2007-12-21
LEE, SANG WOON
Executed: 2007-12-21
Assignee
CHEIL INDUSTRIES INC.
290 GONGDAN 2-DONG, GUMI-SI, GYEONGSANGBUK-DO, 730-710, KOREA, REPUBLIC OF
Covered Property
(1)
Conductive Particles Comprising Complex Metal Layer With Density Gradient, Method for Preparing the Particles, and Anisotropic Conductive Adhesive Composition Comprising the Particles
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 7, 2019
From: SAMSUNG SDI CO., LTD.
To: KUDKO CHEMICAL CO., LTD.
Reel/Frame 050640/0740 →
Merger and Change of Name
Oct 7, 2019
From: CHEIL INDUSTRIES INC.; SAMSUNG SDI CO., LTD.; SAMSUNG SDI CO., LTD.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 050646/0718 →
Assignment of Assignor's Interest
Aug 30, 2022
From: KUKDO CHEMICAL CO., LTD.
To: KUKDO ADVANCED MATERIALS CO., LTD.
Reel/Frame 060940/0414 →
Merger
Mar 26, 2025
From: KUKDO ADVANCED MATERIALS CO., LTD.
To: KUKDO CHEMICAL CO., LTD.
Reel/Frame 070646/0572 →